中国科大微电子学院
  

徐奇

邮箱:xuqi@ustc.edu.cn

进入个人主页

经历:
2012.09- 2018.06 中国科学技术大学,电子科学与技术系,硕士、博士;
2017.09-2017.11 香港中文大学,计算机科学与工程学系,访问学者;
2019.07-2019.09 南方科技大学,计算机科学与工程系,访问学者;
2018.07-2020.10 合肥工业大学,电子科学与应用物理学院,讲师;
2020.11-至今 中国科学技术大学,微电子学院,特任副研究员.

简介:

三维集成电路物理设计自动化,特别是布图规划和布局问题;可靠性设计;神经形态计算系统设计。主持国家自然科学基金青年项目1项,作为骨干参与了科技部重点研发计划等项目的研究工作。在电子设计自动化领域顶级期刊IEEE Trans. on CADACM Trans. DAESIntegration-the VLSI Journal等国际期刊上共发表论文20余篇。

 

荣誉:

中国科学技术大学优秀博士学位论文奖,2018



论文:

1. Qi Xu, Junpeng Wang, Hao Geng, Song Chen and Xiaoqing Wen, “Reliability-Driven Neuromorphic Computing Systems Design”, in IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (CCF-B).

2. Qi Xu, Song Chen, Hao Geng, Bo Yuan, Bei Yu, Feng Wu, Zhengfeng Huang, “Fault Tolerance in Memristive Crossbar-Based Neuromorphic Computing Systems”, Integration, the VLSI Journal, vol. 70, pp. 70–79, 2020. (CCF-C).

3. Qi Xu, Hao Geng, Song Chen, Bei Yu, Feng Wu, “Memristive Crossbar Mapping for Neuromorphic Computing Systems on 3D IC”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 25, no. 1, pp. 8:1–8:19, 2019. (CCF-B).

4. Tianming Ni, Hao Chang, Tai Song, Qi Xu*, Zhengfeng Huang, Huaguo Liang, Aibin Yan , and Xiaoqing Wen, “Non-intrusive Online Distributed Pulse Shrinking Based Interconnect Testing in 2.5D IC”, IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), vol. 67, no. 11, pp. 2657-2661, 2020.

5. Song Chen*, Mengke Ge, Zhigang Li, Jinglei Huang, Qi Xu*, Feng Wu, “Generalized Fault-Tolerance Topology Generation for Application Specific Network-on-Chips”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 39, no. 6, pp. 1191-1204, 2020. (CCF-A).

6. Song Chen, Jinglei Huang, Xiaodong Xu, Bo Ding, Qi Xu, “Integrated Optimization of Partitioning, Scheduling, and Floorplanning for Partially Dynamically Reconfigurable Systems”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 39, no. 1, pp. 199-212, 2020. (CCF-A).

7. Song Chen*, Qi Xu*, Bei Yu, “Adaptive 3D-IC TSV Fault Tolerance Structure Generation”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 38, no. 5, pp. 949-960, 2019. (CCF-A).

8. Qi Xu, Song Chen, Xiaodong Xu, Bei Yu, “Clustered Fault Tolerance TSV Planning for 3D Integrated Circuits”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol.36, no.8, pp.1287-1300, 2017. (CCF-A).

9. Qi Xu, Song Chen, “Fast Thermal Analysis for Fixed-outline 3D Floorplanning”, Integration, the VLSI journal, vol.59, pp.157-167, 2017. (CCF-C).

10. Qi Xu, Song Chen, Bin Li, “Combining the Ant System Algorithm and Simulated Annealing for 3D/2D Fixed-Outline Floorplanning”, Applied Soft Computing, vol.40, pp.150-160, 2016.

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